Thick film sintering furnace
the atmosphere system is especially suitable for the sintering of high-precision chip resistors.
1、Index parameter
Rated temperature: rt-1050 C
Maximum temperature: 1050 degrees centigrade
Sintering atmosphere: air
Heating element: heating FEC ceramic fiber heater
Control temperature area: 7-11
Furnace height: 50-100mm
Temperature zone length: 300/450/600mm
Net band width: 200-1000MM
Outline size: L (6090-7385mm) *W (1200-1400mm) *H1350mm
2、Progressiveness
1, high temperature uniformity: 900mm bandwidth, uniformity of + 2 degrees C, sintered resistance resistance deviation is less than or equal to 3%;
2, special inlet and exhaust structure design, exhaust unobstructed, sintered porcelain without pollution.
3. Precise process control. The holding time at 850 C can reach + 1min.
4. The temperature rise and fall rate is controllable, and with special transmission structure design, the transmission is stable, and the fragmentation rate caused by the equipment is zero.
5, adapt to the development of technology, can be made into nitrogen furnace for sintering copper slurry products.
3、Detail display
四、Application field
- Prev：无
- Next：Push plate furnace
